Blogs

CyberOptics Honored Among Technology Innovators at Prism Awards During Photonics West 2012

Promo ArticleCyberOptics was among 28 technology leaders recently honored at the fourth annual PRISM Awards held during a gala dinner at SPIE Photonics West 2012 in San Francisco.   This international competition recognizescutting-edge products that break conventional ideas and improve life through photonics.

Comparison of Semiconductor Particle Counting Technologies

Reducing or eliminating the presence of particle contaminants is an important step in tool qualification.  While surface scanning is currently the industry standard for particle detection, bench top and hand held airborne particle counters are also used because of their relatively low cost and easy operations.  However, these technologies offer limited reach inside equipment and provide little or no information about the location of contamination in the tool.

WaferSense® Auto Leveling Sensor Keeps Equipment Straight During Wafer Fabrication

Process failures and tool reconfigurations can misalign semiconductor equipment, taking a considerable toll on your productivity. Verifying and realigning equipment can take several hours, causing equipment downtime and loss of revenue. Unlike traditional wired or manual methods, CyberOptics’ WaferSense Auto Leveling System (ALS2) doesn't require equipment disassembly or disruptions to vacuum chambers, so you can reduce calibration time by 80% or more.

Schedule A Private Demo Of WaferSense® Airborne Particle Sensor At Semicon Japan

Visit Us at Booth No. 5B-204

Check out our complete line of WaferSense® wireless metrology devices during Semicon Japan in CyberOptics booth number 5B-204.  We also will demonstrate the final production version of the WaferSense® Airborne Particle Sensor (APS) at the international trade show scheduled for December 5 - 7 at the Makuhari Messe in Chiba, Japan. 

Let Us Prove How WaferSense® Metrology Sensors Can Improve the Productivity Your Fab Operations With An On Site Evaluation

A picture is worth a thousand words.  That’s why CyberOptics offers onsite evaluations of its WaferSense® metrology sensors – within your fab and using your equipment - to show how our technology can improve the productivity and cost efficiency of your electronic assembly operations.

CyberOptics Presented at ISMI Manufacturing Week on “How to Improve Semiconductor Tool Particle Qualification”

Increase Productivity.  Reduce costs.  Stay ahead. That was the theme of ISMI Manufacturing Week this year as well as the focus of CyberOptics’ presentation featured during the ISMI Symposium on Manufacturing Effectiveness. 

WaferSense® Airborne Particle Sensor Finalist for Prism Awards

CyberOptics’ WaferSense® Airborne Particle Sensor is a finalist in the Prism Awards presented by SPIE and Photonics Media.  The Prism Awardsis an international competition recognizing cutting-edge products that break conventional ideas and improve life through photonics.  The program uniquely recognizes scientific innovation among trend-setting technological and industrial categories.

CASE STUDY: WaferSense® Vibration and Leveling Sensor Characterize Tools within Diffusion Furnace to Correct Yield Problems

In an article recently published in EuroAsia Semiconductor,  Allyn Jackson, Field Application Engineer at CyberOptics, discusses how the WaferSense Auto Vibration Sensor (AVS) and Auto Leveling Sensor (ALS) worked jointly to identify and quantify wafer mishandling and excessive vibrations in the various  tools within a 200mm diffusion furnace.

Looking for Solutions in Semiconductor Tool Particle Qualification? Join us at ISMI Manufacturing Week

Join CyberOptics Semiconductor at the 2011 ISMI Manufacturing Week Symposium (October 17-21, in Austin, Texas) as our own Allyn Jackson, Technical Support Manager, will conduct a technical session on October 20th entitled “Wireless Particle Counting Wafer Improves Semiconductor Tool Qualification”.  Mr.

WaferSense® Auto Vibration System Offers SPC Tools for Enhanced Analysis of Semiconductor Equipment Vibration Data

Whenever a wafer is moved or something within the vicinity of the wafer moves, resulting vibration might be a source of wafer defects. Characterizing wafer exposure to vibration is often necessary to identify and resolve seemingly mysterious wafer defect issues. Our WaferSense® Auto Vibration System offers the monitoring tool and analysis software to both identify and quantify vibration sources and effects.

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