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WaferSense® Airborne Particle Sensor Reduces Tool Particle Qualification While Improving Throughput

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Ten Ways How CyberOptics WaferSense® Technology Increase Fab Effectiveness & Yield

  1. The WaferSense group of wireless metrology devices automates particle and vibration detection in semiconductor process tools as well as measurements associated with leveling, gapping and teaching semiconductor equipment, reducing hours of manual measurements while ensuring accurate, repeatable results. 

CyberOptics Honored Among Technology Innovators at Prism Awards During Photonics West 2012

Promo ArticleCyberOptics was among 28 technology leaders recently honored at the fourth annual PRISM Awards held during a gala dinner at SPIE Photonics West 2012 in San Francisco.   This international competition recognizescutting-edge products that break conventional ideas and improve life through photonics.

Comparison of Semiconductor Particle Counting Technologies

Reducing or eliminating the presence of particle contaminants is an important step in tool qualification.  While surface scanning is currently the industry standard for particle detection, bench top and hand held airborne particle counters are also used because of their relatively low cost and easy operations.  However, these technologies offer limited reach inside equipment and provide little or no information about the location of contamination in the tool.

WaferSense® Auto Leveling Sensor Keeps Equipment Straight During Wafer Fabrication

Process failures and tool reconfigurations can misalign semiconductor equipment, taking a considerable toll on your productivity. Verifying and realigning equipment can take several hours, causing equipment downtime and loss of revenue. Unlike traditional wired or manual methods, CyberOptics’ WaferSense Auto Leveling System (ALS2) doesn't require equipment disassembly or disruptions to vacuum chambers, so you can reduce calibration time by 80% or more.

Schedule A Private Demo Of WaferSense® Airborne Particle Sensor At Semicon Japan

Visit Us at Booth No. 5B-204

Check out our complete line of WaferSense® wireless metrology devices during Semicon Japan in CyberOptics booth number 5B-204.  We also will demonstrate the final production version of the WaferSense® Airborne Particle Sensor (APS) at the international trade show scheduled for December 5 - 7 at the Makuhari Messe in Chiba, Japan. 

Let Us Prove How WaferSense® Metrology Sensors Can Improve the Productivity Your Fab Operations With An On Site Evaluation

A picture is worth a thousand words.  That’s why CyberOptics offers onsite evaluations of its WaferSense® metrology sensors – within your fab and using your equipment - to show how our technology can improve the productivity and cost efficiency of your electronic assembly operations.

CyberOptics Presented at ISMI Manufacturing Week on “How to Improve Semiconductor Tool Particle Qualification”

Increase Productivity.  Reduce costs.  Stay ahead. That was the theme of ISMI Manufacturing Week this year as well as the focus of CyberOptics’ presentation featured during the ISMI Symposium on Manufacturing Effectiveness. 

WaferSense® Airborne Particle Sensor Finalist for Prism Awards

CyberOptics’ WaferSense® Airborne Particle Sensor is a finalist in the Prism Awards presented by SPIE and Photonics Media.  The Prism Awardsis an international competition recognizing cutting-edge products that break conventional ideas and improve life through photonics.  The program uniquely recognizes scientific innovation among trend-setting technological and industrial categories.

CASE STUDY: WaferSense® Vibration and Leveling Sensor Characterize Tools within Diffusion Furnace to Correct Yield Problems

In an article recently published in EuroAsia Semiconductor,  Allyn Jackson, Field Application Engineer at CyberOptics, discusses how the WaferSense Auto Vibration Sensor (AVS) and Auto Leveling Sensor (ALS) worked jointly to identify and quantify wafer mishandling and excessive vibrations in the various  tools within a 200mm diffusion furnace.

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